Fei Guo, Kemal Aygun, W. Dale Becker, Stefano Grivet Talocia, Jose A. Hejase, Wui-weng Wong, Tingdong Zhou, Heidi Barnes, Zhen Peng, Alexander Pelger, Mohamed Sahouli, Jose Schutt-aine, Feng Ling, Elmar Griese, Pavel Roy Paladhi, Rohit Sharma, Nam Pham, Thomas-michael Winkel, Evan Fledell, Michael J. Hill, Benjamin Silva, Kaisheng Hu, Jonatan Aronsson, Chang Liu, Yiru Jeong, Ali E. Yilmaz (2021) The IEEE EPS Packaging Benchmark Suite, In: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pp. 1-4, ISBN: 978-1-6654-4269-5
